National Chin-Yi University of Technology | Taiwan
Dr. Yue-Feng Lin is an accomplished researcher and academic specializing in intelligent manufacturing, semiconductor material processing, and precision machining. His work integrates ultrasonic-assisted machining, diamond-wire wafer slicing, and AI-based optimization to enhance precision, efficiency, and sustainability in modern manufacturing. He has completed eight government-funded projects, including two ongoing, and collaborated on industry-academia projects focused on semiconductor process optimization, smart manufacturing, and low-carbon production. which have received 16 citations from 13 documents, with an h-index of 3. He also holds four granted patents and has authored two technical books on advanced material processing and ultrasonic vibration-assisted machining. In addition to his research achievements, he serves as a reviewer for Sensors and Materials and CSME Journal. Dr. Lin’s interdisciplinary expertise bridges academic research and industrial application, driving innovation in precision engineering and sustainable manufacturing. His continued dedication to research excellence and collaborative development contributes significantly to advancing smart manufacturing technologies and promoting global competitiveness in next-generation production systems.
Featured Publications
Lin, Y.-F., Chen, M.-C., Ven, S.-I., Tzoi, M.-R., & Chuong, T.-M. (2025). Intelligent casting method integrating anomaly detection and semantic segmentation. Machines, 13(1), 317.
Lin, Y.-F., Wang, Y.-C., Lien, H.-H., & Tzoi, M. (2016). Geometric-overlap modeling and sweep uniformity optimization of five diamond conditioning disks. International Journal of Advanced Manufacturing Technology, 87(5–8), 225–3710.
Lin, Y.-F., & Wang, Y.-C. (2021). Optimization of ultrasonic-assisted cutting parameters using AI-based prediction models. Applied Sciences, 11(22), 11840.
Lin, Y.-F., Chen, M.-C., & Lien, H.-H. (2020). Analysis of diamond-wire slicing characteristics in semiconductor wafer processing. Materials, 13(15), 3325.
Lin, Y.-F., & Tzoi, M.-R. (2019). Precision control of ultrasonic vibration-assisted machining for difficult-to-cut materials. International Journal of Advanced Manufacturing Technology, 102(1–4), 145–156.