National Cheng-Kung University | Taiwan
Wen-Hsi Lee is a Distinguished Professor in the Department of Electrical Engineering at National Cheng Kung University (NCKU), Taiwan, with an h-index of 21, over 170 documents, and more than 1744 citations. He received his B.S. in Chemistry from National Chung-Hua Normal University, M.S. in Materials Science from National Sun Yat-Sen University, Ph.D. in Electronic Engineering from National Chiao-Tung University, and an Executive M.S. in Business Administration from National Sun Yat-Sen University. Prof. Lee has extensive industrial experience, serving as Chief Engineer and Manager at Taiwan Philips R&D, Scientist at Germany Philips Aachen Lab, and AVP at Phycomp/Yageo R&D. Academically, he joined NCKU, progressing from Assistant to Full Professor, and has served as Visiting Professor at Penn State University and Tohoku University. His research interests include semiconductor thin film processes, dielectric materials, 2D materials and devices, ion implantation and annealing, organic thin film transistors, and thin film solar cells. Prof. Lee has been recognized with numerous awards, including the National Industrial Innovation Award, Future Tech Award, Ceramic Industry Award, and TSIA Semiconductor Award. His work bridges academia and industry, advancing semiconductor device technology and contributing to global research in thin films and electronic materials.
Featured Publications
Lee, W.-H., Puteri, N. G., & Chen, S. S. (2025). Air-sintered copper-aluminum alloy inner electrodes. Journal of Materials Science: Materials in Electronics, 36(14).
Lee, W.-H., Chien, C. F., & Ku, C. T. (2025). Studies on CuNi alloy with zinc protective layer sintered in air. ES Manufacturing Materials.
Lee, W.-H., Kuo, C. R., & Chen, H. E. (2025). A study on grain boundary barrier layer solid aluminum capacitors. Open Ceramics.
Lee, W.-H., Kuo, E., Hung, C.-N., & Kuo, T.-C. (2025). Investigating the effects of etching system and low temperature thermal processing on hafnium zirconium oxide thin film properties. Journal of Vacuum Science & Technology A, 43, 012602.
Lee, W.-H., Divya, P., & Kuo, T.-C. (2024). Air-sintered copper-nickel resistor with aluminum layer for oxidation prevention. MRS Communications, 1–6.